Study of the brittle fracture of monocrystalline silicon wafers

Barredo Egusquiza, Josu and Fraile de Lerma, Alberto and Alarcón Álvarez, Enrique (2005). Study of the brittle fracture of monocrystalline silicon wafers. In: "Tenth International Conference on Civil, Structural and Environmental Engineering Computing", 30/08/2005 - 02/09/2005, Roma, Italy. pp. 1-12. https://doi.org/10.4203/ccp.81.104.

Description

Title: Study of the brittle fracture of monocrystalline silicon wafers
Author/s:
  • Barredo Egusquiza, Josu
  • Fraile de Lerma, Alberto
  • Alarcón Álvarez, Enrique
Item Type: Presentation at Congress or Conference (Article)
Event Title: Tenth International Conference on Civil, Structural and Environmental Engineering Computing
Event Dates: 30/08/2005 - 02/09/2005
Event Location: Roma, Italy
Title of Book: Tenth International Conference on Civil, Structural and Environmental Engineering Computing
Date: 2005
Subjects:
Freetext Keywords: Four line bending test, finite elements, large displacement, monocrystalline silicon wafer, cleavage plane, size effect
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

There is a growing trend towards using thinner wafers in order to reduce the costs of solar energy. But the current tools employed during the solar cells production are not prepared to work with thinner wafers, decreasing the industrial yield due to the high number of wafers broken. To develop new tools, or modify existing ones, the mechanical properties have to be determined. This paper tackles an experimental study of the mechanical properties of wafers. First, the material characteristics are detailed and the process to obtain wafers is presented. Then, the complete test setup and the mechanical strength results interpreted by a described numerical model are shown.

More information

Item ID: 19359
DC Identifier: http://oa.upm.es/19359/
OAI Identifier: oai:oa.upm.es:19359
DOI: 10.4203/ccp.81.104
Official URL: http://www.ctresources.info/ccp/paper.html?id=267
Deposited by: Memoria Investigacion
Deposited on: 02 Feb 2014 11:24
Last Modified: 21 Apr 2016 17:37
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