Damage reduction of the laser drilling process on back contact solar cells by chemical treatment

Cereceda, Eneko and Barredo Egusquiza, Josu and Gutierrez, José Rubén and Jimeno Cuesta, Juan Carlos and Fraile de Lerma, Alberto and Hermanns, Lutz Karl Heinz (2012). Damage reduction of the laser drilling process on back contact solar cells by chemical treatment. In: "27th European Photovoltaic Solar Energy Conference and Exhibition", 24/09/2012 - 28/09/2012, Frankfurt, Germany. pp. 832-835. https://doi.org/10.4229/27thEUPVSEC2012-2DO.2.3.

Description

Title: Damage reduction of the laser drilling process on back contact solar cells by chemical treatment
Author/s:
  • Cereceda, Eneko
  • Barredo Egusquiza, Josu
  • Gutierrez, José Rubén
  • Jimeno Cuesta, Juan Carlos
  • Fraile de Lerma, Alberto
  • Hermanns, Lutz Karl Heinz
Item Type: Presentation at Congress or Conference (Article)
Event Title: 27th European Photovoltaic Solar Energy Conference and Exhibition
Event Dates: 24/09/2012 - 28/09/2012
Event Location: Frankfurt, Germany
Title of Book: 27th European Photovoltaic Solar Energy Conference and Exhibition
Date: 2012
Subjects:
Freetext Keywords: Damage Reduction, Back Contact, Laser Processing, Etching, Texturisation
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

Production of back contact solar cells requires holes generations on the wafers to keep both positive and negative contacts on the back side of the cell. This drilling process weakens the wafer mechanically due to the presence of the holes and the damage introduced during the process as microcracks. In this study, several chemical processes have been applied to drilled wafers in order to eliminate or reduce the damage generated during this fabrication step. The treatments analyzed are the followings: alkaline etching during 1, 3 and 5 minutes, acid etching for 2 and 4 minutes and texturisation. To determine mechanical strength of the samples a common mechanical study has been carried out testing the samples by the Ring on Ring bending test and obtaining the stress state in the moment of failure by FE simulation. Finally the results obtained for each treatment were fitted to a three parameter Weibull distribution

More information

Item ID: 20469
DC Identifier: http://oa.upm.es/20469/
OAI Identifier: oai:oa.upm.es:20469
DOI: 10.4229/27thEUPVSEC2012-2DO.2.3
Deposited by: Memoria Investigacion
Deposited on: 26 Feb 2014 18:05
Last Modified: 21 Apr 2016 23:18
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