Crack origin and detection in thin cristallyne solar cells in a production line

Cereceda, Eneko and Gutierrez, José Rubén and Jimeno, Juan Carlos and Barredo Egusquiza, Josu and Fraile de Lerma, Alberto and Alarcón Álvarez, Enrique and Ostapenko, Sergei and Martínez, A. and Vázquez, M.A. (2007). Crack origin and detection in thin cristallyne solar cells in a production line. In: "22nd European Photovoltaic Solar Energy Conference and Exhibition", 03/09/2007-07/09/2007, Milan, Italia. ISBN 3-936338-2-80.

Description

Title: Crack origin and detection in thin cristallyne solar cells in a production line
Author/s:
  • Cereceda, Eneko
  • Gutierrez, José Rubén
  • Jimeno, Juan Carlos
  • Barredo Egusquiza, Josu
  • Fraile de Lerma, Alberto
  • Alarcón Álvarez, Enrique
  • Ostapenko, Sergei
  • Martínez, A.
  • Vázquez, M.A.
Item Type: Presentation at Congress or Conference (Article)
Event Title: 22nd European Photovoltaic Solar Energy Conference and Exhibition
Event Dates: 03/09/2007-07/09/2007
Event Location: Milan, Italia
Title of Book: Proceedings : 22nd European Photovoltaic Solar Energy Conference
Date: 2007
ISBN: 3-936338-2-80
Subjects:
Freetext Keywords: Crack detection ; Cost reduction ; Manufacturing and Processing
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

In order to reduce cost and make up for the rising price of silicon, silicon wafers are sliced thinner and wider,eading to weaker wafers and increased breakage rates during fabrication process. In this work we have analysed different cracks origins and their effect on wafer’s mechanical strength. To enhance wafer’s strength some etching methods have been tested. Also, we have analysed wafers from different points of an entire standard production process. Mechanical strength of the wafers has been obtained via the four line bending test and detection of cracks has been tested with Resonance Ultrasonic Vibration (RUV) system, developed by the University of South Florida.

More information

Item ID: 21073
DC Identifier: http://oa.upm.es/21073/
OAI Identifier: oai:oa.upm.es:21073
Official URL: http://www.eupvsec-proceedings.com/
Deposited by: Biblioteca ETSI Industriales
Deposited on: 03 Oct 2013 09:52
Last Modified: 21 Apr 2016 11:11
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