A dislocation dynamics study of the strength of stacking fault tetrahedra. Part II: interactions with mixed and edge dislocations

Martínez Sáez, Enrique and Marian, Jaime and Perlado Martín, José Manuel (2008). A dislocation dynamics study of the strength of stacking fault tetrahedra. Part II: interactions with mixed and edge dislocations. "Philosophical Magazine", v. 88 (n. 6); pp. 841-863. ISSN 1478-6435. https://doi.org/10.1080/14786430801986654.

Description

Title: A dislocation dynamics study of the strength of stacking fault tetrahedra. Part II: interactions with mixed and edge dislocations
Author/s:
  • Martínez Sáez, Enrique
  • Marian, Jaime
  • Perlado Martín, José Manuel
Item Type: Article
Título de Revista/Publicación: Philosophical Magazine
Date: February 2008
ISSN: 1478-6435
Volume: 88
Subjects:
Freetext Keywords: dislocation dynamics; irradiation damage; stacking-fault tetrahedron; mechanical properties; Cu.
Faculty: E.T.S.I. Industriales (UPM)
Department: Ingeniería Nuclear [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

Full text

[img]
Preview
PDF - Requires a PDF viewer, such as GSview, Xpdf or Adobe Acrobat Reader
Download (614kB) | Preview

Abstract

In this paper we present the sequel to Part I and present a comprehensive dislocation dynamics study of the strength of stacking fault tetrahedra to mixed and edge dislocation glides in fcc Cu.

More information

Item ID: 2692
DC Identifier: http://oa.upm.es/2692/
OAI Identifier: oai:oa.upm.es:2692
DOI: 10.1080/14786430801986654
Official URL: http://www.tandf.co.uk/journals/tphm
Deposited by: Memoria Investigacion
Deposited on: 24 Mar 2010 09:44
Last Modified: 06 Sep 2017 16:49
  • Logo InvestigaM (UPM)
  • Logo GEOUP4
  • Logo Open Access
  • Open Access
  • Logo Sherpa/Romeo
    Check whether the anglo-saxon journal in which you have published an article allows you to also publish it under open access.
  • Logo Dulcinea
    Check whether the spanish journal in which you have published an article allows you to also publish it under open access.
  • Logo de Recolecta
  • Logo del Observatorio I+D+i UPM
  • Logo de OpenCourseWare UPM