Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature

Monclús, M. A. and Karlik, M. and Callisti, M. and Frutos, E. and Llorca Martinez, Francisco Javier and Polcar, T. and Molina Aldareguía, Jon M. (2014). Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature. "Thin Solid Films", v. 571 ; pp. 275-282. ISSN 0040-6090. https://doi.org/10.1016/j.tsf.2014.05.044.

Description

Title: Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature
Author/s:
  • Monclús, M. A.
  • Karlik, M.
  • Callisti, M.
  • Frutos, E.
  • Llorca Martinez, Francisco Javier
  • Polcar, T.
  • Molina Aldareguía, Jon M.
Item Type: Article
Título de Revista/Publicación: Thin Solid Films
Date: 27 May 2014
Volume: 571
Subjects:
Freetext Keywords: Copper–tungsten multilayers, Mechanical properties, Microstructure, Hot hardness
Faculty: E.T.S.I. Caminos, Canales y Puertos (UPM)
Department: Ciencia de los Materiales
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

Based on our previous knowledge on Cu/Nb nanoscale metallic multilayers (NMMs), Cu/WNMMs show a good potential for applications as heat skins in plasma experiments and armors, and it could be expected that the substitution of Nb byWwould increase the strength, particularly at high temperatures. To check this hypothesis, Cu/WNMMs with individual layer thicknesses ranging between 5 and 30 nm were deposited by physical vapour deposition, and their mechanical properties were measured by nanoindentation. The results showed that, contrary to Cu/Nb NMMs, the hardness was independent of the layer thickness and decreased rapidlywith temperature, especially above 200 °C. This behavior was attributed to the growth morphology of theWlayers aswell as the jagged Cu/W interface, both a consequence of the lowW adatom mobility during deposition. Therefore, future efforts on the development of Cu/Wmultilayers should concentrate on optimization of theWdeposition parameters via substrate heating and/or ion assisted deposition to increase the W adatom mobility during deposition.

Funding Projects

TypeCodeAcronymLeaderTitle
FP7263273RADINTERFACESCENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRSMultiscale Modelling and Materials by Design of interface-controlled Radiation Damage in Crystalline Materials
Government of SpainMAT2012-31889UnspecifiedUnspecifiedUnspecified

More information

Item ID: 35459
DC Identifier: http://oa.upm.es/35459/
OAI Identifier: oai:oa.upm.es:35459
DOI: 10.1016/j.tsf.2014.05.044
Official URL: http://linkinghub.elsevier.com/retrieve/pii/S0040609014005793
Deposited by: Memoria Investigacion
Deposited on: 08 Jun 2015 11:11
Last Modified: 16 May 2019 07:32
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