Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature

Monclús, M. A.; Karlik, M.; Callisti, M.; Frutos, E.; Llorca Martinez, Francisco Javier; Polcar, T. y Molina Aldareguía, Jon M. (2014). Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature. "Thin Solid Films", v. 571 ; pp. 275-282. ISSN 0040-6090. https://doi.org/10.1016/j.tsf.2014.05.044.

Descripción

Título: Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature
Autor/es:
  • Monclús, M. A.
  • Karlik, M.
  • Callisti, M.
  • Frutos, E.
  • Llorca Martinez, Francisco Javier
  • Polcar, T.
  • Molina Aldareguía, Jon M.
Tipo de Documento: Artículo
Título de Revista/Publicación: Thin Solid Films
Fecha: 27 Mayo 2014
Volumen: 571
Materias:
Palabras Clave Informales: Copper–tungsten multilayers, Mechanical properties, Microstructure, Hot hardness
Escuela: E.T.S.I. Caminos, Canales y Puertos (UPM)
Departamento: Ciencia de los Materiales
Licencias Creative Commons: Reconocimiento - Sin obra derivada - No comercial

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Resumen

Based on our previous knowledge on Cu/Nb nanoscale metallic multilayers (NMMs), Cu/WNMMs show a good potential for applications as heat skins in plasma experiments and armors, and it could be expected that the substitution of Nb byWwould increase the strength, particularly at high temperatures. To check this hypothesis, Cu/WNMMs with individual layer thicknesses ranging between 5 and 30 nm were deposited by physical vapour deposition, and their mechanical properties were measured by nanoindentation. The results showed that, contrary to Cu/Nb NMMs, the hardness was independent of the layer thickness and decreased rapidlywith temperature, especially above 200 °C. This behavior was attributed to the growth morphology of theWlayers aswell as the jagged Cu/W interface, both a consequence of the lowW adatom mobility during deposition. Therefore, future efforts on the development of Cu/Wmultilayers should concentrate on optimization of theWdeposition parameters via substrate heating and/or ion assisted deposition to increase the W adatom mobility during deposition.

Más información

ID de Registro: 35459
Identificador DC: http://oa.upm.es/35459/
Identificador OAI: oai:oa.upm.es:35459
Identificador DOI: 10.1016/j.tsf.2014.05.044
URL Oficial: http://linkinghub.elsevier.com/retrieve/pii/S0040609014005793
Depositado por: Memoria Investigacion
Depositado el: 08 Jun 2015 11:11
Ultima Modificación: 27 May 2016 22:30
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