Transference Impedance Estimation of IEC60318 Couplers by Image Processing and finite Element Modelling

Bravo, Agustin and Ruiz González, Mariano and López Navarro, Juan Manuel and Arcas Castro, Guillermo de and Sumpsi, M. (2008). Transference Impedance Estimation of IEC60318 Couplers by Image Processing and finite Element Modelling. In: "IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2008)", 12/05/2008-15/05/2008, Vancuver, Canada. ISBN 978-1-424-41540-3.

Description

Title: Transference Impedance Estimation of IEC60318 Couplers by Image Processing and finite Element Modelling
Author/s:
  • Bravo, Agustin
  • Ruiz González, Mariano
  • López Navarro, Juan Manuel
  • Arcas Castro, Guillermo de
  • Sumpsi, M.
Item Type: Presentation at Congress or Conference (Article)
Event Title: IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2008)
Event Dates: 12/05/2008-15/05/2008
Event Location: Vancuver, Canada
Title of Book: Proceedings of IEEE International Instrumentation and Measurement Technology Conference (I2MTC 2008)
Date: 2008
ISBN: 978-1-424-41540-3
Subjects:
Freetext Keywords: calibration, image processing, non invasive measurement system, finite element modeling, virtual measurement system, acoustic impedance measurement.
Faculty: E.U.I.T. Telecomunicación (UPM)
Department: Sistemas Electrónicos y de Control [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

Full text

[img]
Preview
PDF - Requires a PDF viewer, such as GSview, Xpdf or Adobe Acrobat Reader
Download (1MB) | Preview

Abstract

In order to know the acoustic transference impedance of acoustic coupler described in IEC60318 standard it is necessary to make measures based on the reciprocity technique. This technique is used for microphones calibration as is defined in IEC61094-2 standard. This calibration method is complex enough to execute, and therefore it would be very interesting to look for alternative procedures that allow knowing the coupler acoustic impedance. In this paper an acoustic impedance calibration methodfor type I coupler is proposed based on non invasive X-ray inspection, virtual instrumentation image processing application and computer simulation. This new approach requires knowing the coupler's geometry and use offinite element model approach for acoustic coupler behavior determination. In order to establish a precise mechanical model of the couplers described in IEC60318 standard it is necessary to know the geometry and key dimensions of the coupler. These dimensions are obtained with non-invasive measurement techniques, based on X-ray inspection. Then the use of a finite element model allows prediction of the coupler acoustic impedance values. This modeling is quite differentfrom the "lumped parameter model" proposed in the IEC60318 standard Lumped parameter modeling has limitations in its application because the dimensions of the coupler's elements are comparable with the acoustic signal wavelength. Moreover, when the sound propagates in narrow cavities and ducts the losses produced by viscosity and thermal effects must be taken into account. All these effects are not reflected with accuracy in the classic lumped model. The result of finite element simulation can provide more detailed information about the interior acoustic behavior of the coupler and therefore provide a more realistic and accurate value of acoustic impedance in order to calibrate the device. The comparison of the data obtained with this new approach and the values defined in the current version of IEC60318-1 standard (291633/CDV) confirm the validity ofthe method.

More information

Item ID: 3855
DC Identifier: http://oa.upm.es/3855/
OAI Identifier: oai:oa.upm.es:3855
Official URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4547415&userType=&tag=1
Deposited by: Memoria Investigacion
Deposited on: 29 Jul 2010 10:44
Last Modified: 20 Apr 2016 13:18
  • Logo InvestigaM (UPM)
  • Logo GEOUP4
  • Logo Open Access
  • Open Access
  • Logo Sherpa/Romeo
    Check whether the anglo-saxon journal in which you have published an article allows you to also publish it under open access.
  • Logo Dulcinea
    Check whether the spanish journal in which you have published an article allows you to also publish it under open access.
  • Logo de Recolecta
  • Logo del Observatorio I+D+i UPM
  • Logo de OpenCourseWare UPM