The design of a novel structural four-beams-bossedmembrane (FBBM) piezoresistive pressure sensor

Li, Chuang and Cordovilla Baró, Francisco and Ocaña Moreno, José Luis (2017). The design of a novel structural four-beams-bossedmembrane (FBBM) piezoresistive pressure sensor. In: "2017 Spanish Conference on Electron Devices (CDE 2017)", 8-10 February 2017, Barcelona (Spain). ISBN 978-1-5090-5073-4. pp. 94-97.

Description

Title: The design of a novel structural four-beams-bossedmembrane (FBBM) piezoresistive pressure sensor
Author/s:
  • Li, Chuang
  • Cordovilla Baró, Francisco
  • Ocaña Moreno, José Luis
Item Type: Presentation at Congress or Conference (Article)
Event Title: 2017 Spanish Conference on Electron Devices (CDE 2017)
Event Dates: 8-10 February 2017
Event Location: Barcelona (Spain)
Title of Book: 2017 Spanish Conference on Electron Devices (CDE 2017)
Date: 2017
ISBN: 978-1-5090-5073-4
Subjects:
Freetext Keywords: MEMS piezoresistive pressure sensor; Four-beamsbossed-membrane; Finite element analysis; Dimensions optimization; Sensitivity and linearity
Faculty: E.T.S.I. Industriales (UPM)
Department: Física Aplicada e Ingeniería de Materiales
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

This paper presents a novel structural piezoresistive pressure sensor with four-beams-bossed-membrane (FBBM) that consisted of four short beams and a central mass to measure micro-pressure. In this work, the model design, dimensions optimization, and main fabrication processes are involved. The finite element analysis (FEA) is used to study the stress distribution of sensitive elements and deflection of membrane. Subsequently, the relationships between the structural dimensions and the mechanical performance are deduced. Finally, curve fittings of the mechanical stress and deflection based on simulation results are performed to establish a series of equations of the sensor. According to the optimization processes, the FBBM structural membrane dimensions are ultimately determined. The main fabrication processes of the pressure sensor chip based on MEMS bulk-micromachining and anodic bonding technology are also introduced. The results show that a high sensitivity of 4.71 mV/V/kPa and a low pressure nonlinearity of 0.75% FSS can be achieved, indicating that this novel structure is a proper choice for pressure measurements less than 5 kPa.

Funding Projects

TypeCodeAcronymLeaderTitle
Government of Spain2015‐1‐ES01‐KA107‐015460UnspecifiedUnspecifiedUnspecified

More information

Item ID: 53264
DC Identifier: http://oa.upm.es/53264/
OAI Identifier: oai:oa.upm.es:53264
Deposited by: Memoria Investigacion
Deposited on: 19 Dec 2018 19:29
Last Modified: 19 Dec 2018 19:29
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