DEMO: Multi-Grain Adaptivity in Cyber-Physical Systems

Rodríguez Medina, Alfonso and Fanni, Tiziana (2018). DEMO: Multi-Grain Adaptivity in Cyber-Physical Systems. In: "2018 30th International Conference on Microelectronics (ICM)", 16-19 Dec. 2018, Sousse, Tunisia. ISBN 978-1-5386-8167-1. pp. 1-4. https://doi.org/10.1109/ICM.2018.8704058.

Description

Title: DEMO: Multi-Grain Adaptivity in Cyber-Physical Systems
Author/s:
  • Rodríguez Medina, Alfonso
  • Fanni, Tiziana
Item Type: Presentation at Congress or Conference (Article)
Event Title: 2018 30th International Conference on Microelectronics (ICM)
Event Dates: 16-19 Dec. 2018
Event Location: Sousse, Tunisia
Title of Book: Proceeding of 2018 30th International Conference on Microelectronics
Date: 2018
ISBN: 978-1-5386-8167-1
Subjects:
Faculty: E.T.S.I. Industriales (UPM)
Department: Automática, Ingeniería Eléctrica y Electrónica e Informática Industrial
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

Cyber-Physical Systems (CPS) operate in increasingly complex and demanding application scenarios, while requiring also high adaptivity levels to satisfy several requirements that usually change over time. Multi-grain reconfigurable hardware architectures are an appealing solution to provide high, heterogeneous flexibility, thus reaching the advanced runtime adaptivity support necessary for CPS. This work presents a demonstration of an automated framework for the development and runtime management of multi-grain reconfigurable hardware systems. The framework supports different reconfiguration mechanisms, each with different overheads and depth in terms of system behavior modification.

Funding Projects

TypeCodeAcronymLeaderTitle
Horizon 2020732105CERBEROUnspecifiedCross-layer modEl-based fRamework for multi-oBjective dEsign of Reconfigurable systems in unceRtain hybRid envirOnments

More information

Item ID: 55151
DC Identifier: http://oa.upm.es/55151/
OAI Identifier: oai:oa.upm.es:55151
DOI: 10.1109/ICM.2018.8704058
Official URL: https://ieeexplore.ieee.org/document/8704058
Deposited by: Memoria Investigacion
Deposited on: 03 Jun 2019 14:14
Last Modified: 03 Jun 2019 14:14
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