The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers

Barredo Egusquiza, Josu and Hermanns, Lutz Karl Heinz and Fraile de Lerma, Alberto and Jimeno, Juan Carlos and Alarcón Álvarez, Enrique (2007). The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers. In: "22nd European Photovoltaic Solar Energy Conference and Exhibition", 03/09/2007-07/09/2007, Milan, Italia. ISBN 3-936338-2-80.

Description

Title: The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers
Author/s:
  • Barredo Egusquiza, Josu
  • Hermanns, Lutz Karl Heinz
  • Fraile de Lerma, Alberto
  • Jimeno, Juan Carlos
  • Alarcón Álvarez, Enrique
Item Type: Presentation at Congress or Conference (Article)
Event Title: 22nd European Photovoltaic Solar Energy Conference and Exhibition
Event Dates: 03/09/2007-07/09/2007
Event Location: Milan, Italia
Title of Book: Proceedings : 22nd European Photovoltaic Solar Energy Conference
Date: 2007
ISBN: 3-936338-2-80
Subjects:
Freetext Keywords: Cost reduction ; Manufacturing and Processing ; Reliability
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

Full text

[thumbnail of THE_INFLUENCE_OF_DIFFERENT_SURFACE_TREATMENTS_ON_THE.pdf]
Preview
PDF - Requires a PDF viewer, such as GSview, Xpdf or Adobe Acrobat Reader
Download (261kB) | Preview

Abstract

The implementation of photovoltaic solar energy based on silicon is being slowed down by the shortage of raw material. In this context, the use of thinner wafers arises as a solution reducing the amount of silicon in the photovoltaic modules. On the other hand, the manufacturing process with thinner wafers can become complicated with traditional tools. The high number of damaged wafers reduces the global yield. It’s known that edge and surface cracks and defects determine the mechanical strength of wafers. There are several ways of removing these defects e. g. subjecting wafers to a mechanical polishing or to a chemical etching. This paper shows a comparison between different surface treatments and their influence on the mechanical strength.

More information

Item ID: 21043
DC Identifier: https://oa.upm.es/21043/
OAI Identifier: oai:oa.upm.es:21043
Official URL: http://www.eupvsec-proceedings.com/
Deposited by: Biblioteca ETSI Industriales
Deposited on: 03 Oct 2013 08:48
Last Modified: 21 Apr 2016 11:09
  • Logo InvestigaM (UPM)
  • Logo GEOUP4
  • Logo Open Access
  • Open Access
  • Logo Sherpa/Romeo
    Check whether the anglo-saxon journal in which you have published an article allows you to also publish it under open access.
  • Logo Dulcinea
    Check whether the spanish journal in which you have published an article allows you to also publish it under open access.
  • Logo de Recolecta
  • Logo del Observatorio I+D+i UPM
  • Logo de OpenCourseWare UPM