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Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers
Citation
Barredo Egusquiza, Josu 
ORCID: https://orcid.org/0000-0002-1321-2251, Hermanns, Lutz Karl Heinz ORCID: https://orcid.org/0000-0002-0367-3740, Fraile de Lerma, Alberto ORCID: https://orcid.org/0000-0001-9861-0728, Jimeno, Juan Carlos and Alarcón Álvarez, Enrique ORCID: https://orcid.org/0000-0001-6538-7814
(2009).
Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers.
In: "24th European Photovoltaic Solar Energy Conference and Exhibition", 21/09/2009-25/09/2009, Hamburg, Germany. ISBN 3-936338-25-6.
Description
| Title: | Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers |
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| Author/s: |
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| Item Type: | Presentation at Congress or Conference (Article) |
| Event Title: | 24th European Photovoltaic Solar Energy Conference and Exhibition |
| Event Dates: | 21/09/2009-25/09/2009 |
| Event Location: | Hamburg, Germany |
| Title of Book: | Proceedings of the 24th European Photovoltaic Solar Energy Conference |
| Date: | 2009 |
| ISBN: | 3-936338-25-6 |
| Subjects: | |
| Freetext Keywords: | Cost reduction ; Defects ; Characterization |
| Faculty: | E.T.S.I. Industriales (UPM) |
| Department: | Mecánica Estructural y Construcciones Industriales [hasta 2014] |
| Creative Commons Licenses: | Recognition - No derivative works - Non commercial |
Abstract
The objective of the present study is the estimation of the depth to which the wire sawing process causes damage to the wafer surfaces. Previous analyses were carried out by means of the four line bending test. The characteristic of this test implied that the failure could be due to surface cracks located in the central zone of the wafer or near the edges. In order to evaluate the influence of the edge or surface cracks a new study has been carried out using the ball/ring on ring test. Description and results of the tests are presented. The preliminary analysis of the failure stress using analytical methods confirms the expected results. A Finite Element model developed to get more information of the test results is also presented.
More information
| Item ID: | 21627 |
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| DC Identifier: | https://oa.upm.es/21627/ |
| OAI Identifier: | oai:oa.upm.es:21627 |
| Official URL: | http://www.eupvsec-proceedings.com/proceedings?pap... |
| Deposited by: | Biblioteca ETSI Industriales |
| Deposited on: | 16 Nov 2013 07:37 |
| Last Modified: | 21 Apr 2016 12:19 |
