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Optimization of curing cycle in carbon fiber-reinforced laminates: Void distribution and mechanical properties
Citation
Hernández, S., Sket, Federico, González Martínez, Carlos Daniel 
ORCID: https://orcid.org/0000-0002-0724-138X and Llorca Martinez, Francisco Javier ORCID: https://orcid.org/0000-0002-3122-7879
(2013).
Optimization of curing cycle in carbon fiber-reinforced laminates: Void distribution and mechanical properties.
"Composites Science and Technology", v. 85
;
pp. 73-82.
ISSN 0266-3538.
https://doi.org/10.1016/j.compscitech.2013.06.005.
Description
| Title: | Optimization of curing cycle in carbon fiber-reinforced laminates: Void distribution and mechanical properties |
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| Author/s: |
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| Item Type: | Article |
| Título de Revista/Publicación: | Composites Science and Technology |
| Date: | 21 August 2013 |
| ISSN: | 0266-3538 |
| Volume: | 85 |
| Subjects: | |
| Faculty: | E.T.S.I. Caminos, Canales y Puertos (UPM) |
| Department: | Ciencia de los Materiales |
| Creative Commons Licenses: | Recognition - No derivative works - Non commercial |
Abstract
A strategy is presented to optimize out-of-autoclave processing of quasi-isotropic carbon fiber-reinforced laminates. Square panels of 4.6 mm nominal thickness with very low porosity ð6 0:2%Þ were manufactured by compression molding at low pressure (0.2 MPa) by careful design of the temperature cycle to maximize the processing window. The mechanisms of void migration during processing were ascertained by means of X-ray microtomography and the effect of ply clustering on porosity and on void shape was explained. Finally, the effect of porosity and ply clustering on the compressive strength before and after impact was studied.
More information
| Item ID: | 29071 |
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| DC Identifier: | https://oa.upm.es/29071/ |
| OAI Identifier: | oai:oa.upm.es:29071 |
| DOI: | 10.1016/j.compscitech.2013.06.005 |
| Official URL: | http://www.sciencedirect.com/science/article/pii/S... |
| Deposited by: | Memoria Investigacion |
| Deposited on: | 05 Jun 2014 12:33 |
| Last Modified: | 10 Feb 2023 11:51 |
