Export: Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Lotfian, S. and Molina Aldareguía, Jon M. and Yazzie, K.E. and Llorca Martinez, Francisco Javier and Chawla, N. (2013). Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation. "Journal of electronic materials", v. 42 (n. 6); pp. 1085-1091. ISSN 0361-5235. https://doi.org/10.1007/s11664-013-2517-z.

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