title: The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers
creator: Barredo Egusquiza, Josu
creator: Hermanns, Lutz Karl Heinz
creator: Fraile de Lerma, Alberto
creator: Jimeno, Juan Carlos
creator: Alarcón Álvarez, Enrique
subject: Renewable Energy
description: The implementation of photovoltaic solar energy based on silicon is being slowed down by the shortage of raw material. In this context, the use of thinner wafers arises as a solution reducing the amount of silicon in the photovoltaic modules. On the other hand, the manufacturing process with thinner wafers can become complicated with traditional tools. The high number of damaged wafers reduces the global yield. It’s known that edge and surface cracks and defects determine the mechanical strength of wafers. There are several ways of removing these defects e. g. subjecting wafers to a mechanical polishing or to a chemical etching. This paper shows a comparison between different surface treatments and their influence on the mechanical strength.
publisher: E.T.S.I. Industriales (UPM)
rights: https://creativecommons.org/licenses/by-nc-nd/3.0/es/
date: 2007
type: info:eu-repo/semantics/conferenceObject
type: Presentation at Congress or Conference
source: Proceedings : 22nd European Photovoltaic Solar Energy Conference | 22nd European Photovoltaic Solar Energy Conference and Exhibition | 03/09/2007-07/09/2007 | Milan, Italia
type: PeerReviewed
format: application/pdf
language: eng
relation: http://www.eupvsec-proceedings.com/
rights: info:eu-repo/semantics/openAccess
identifier: https://oa.upm.es/21043/