eprintid: 21043
rev_number: 36
eprint_status: archive
userid: 2664
dir: disk0/00/02/10/43
datestamp: 2013-10-03 08:48:15
lastmod: 2016-04-21 11:09:27
status_changed: 2013-10-03 08:48:15
type: conference_item
metadata_visibility: show
item_issues_count: 0
creators_name: Barredo Egusquiza, Josu
creators_name: Hermanns, Lutz Karl Heinz
creators_name: Fraile de Lerma, Alberto
creators_name: Jimeno, Juan Carlos
creators_name: Alarcón Álvarez, Enrique
creators_id: jbarredo@etsii.upm.es
creators_id: lutz.hermanns@upm.es
creators_id: alberto.fraile@upm.es
creators_id: jcjimeno@jet.es
creators_id: enrique.alarcon@upm.es
title: The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers
ispublished: pub
subjects: renovables
keywords: Cost reduction ; Manufacturing and Processing ; Reliability
abstract: The implementation of photovoltaic solar energy based on silicon is being slowed down by the shortage of raw material. In this context, the use of thinner wafers arises as a solution reducing the amount of silicon in the photovoltaic modules. On the other hand, the manufacturing process with thinner wafers can become complicated with traditional tools. The high number of damaged wafers reduces the global yield. It’s known that edge and surface cracks and defects determine the mechanical strength of wafers. There are several ways of removing these defects e. g. subjecting wafers to a mechanical polishing or to a chemical etching. This paper shows a comparison between different surface treatments and their influence on the mechanical strength.
date: 2007
date_type: published
publisher: WIP-Renewable Energies
official_url: http://www.eupvsec-proceedings.com/
full_text_status: public
pres_type: paper
place_of_pub: Munich
pages: 4
event_title: 22nd European Photovoltaic Solar Energy Conference and Exhibition
event_location: Milan, Italia
event_dates: 03/09/2007-07/09/2007
event_type: conference
institution: Industriales
department: Mecanica2
refereed: TRUE
isbn: 3-936338-2-80
book_title: Proceedings : 22nd European Photovoltaic Solar Energy Conference
referencetext: [1] J. Barredo, A. Fraile, J. C. Jimeno, E. Alarcón. Mechanical characterization of monocrystalline silicon wafers. 20th European Photovoltaic Solar Energy Conference, Barcelona, Spain, 2005 [2] C. Funke, O. Sciurova, S. Kaminski, W. Fütterer, H.J. Möller. Mechanical properties of thin silicon wafers. 21st European Photovoltaic Solar Energy Conference, Dresden, Germany, 2006 [3] E. Cereceda, J. R. Gutiérrez, J. C. Jimeno, J. Barredo,A. Fraile, E. Alarcón, S. Ostapenko, A. Martínez, M.A. Vázquez. Crack origin and detection in thin cristallyne solar cells in a production line. 22nd European Photovoltaic Solar Energy Conference, Milan, Italy, 2007 [4] B. Cotterell, Z. Chen, J. B. Han, N. X. Tan. The Strength of the Silicon Die in Flip-Chip Assemblies. Journal of electronic packaging, ASME, USA, 2003. [5] A. Luque, S. Hegedus. Handbook of Photovoltaic Science and Engineering. John Wiley & Sons Ltd,
West Sussex, England, 2003 [6] D. Broek. Elementary Engineering Fracture Mechanics. Martinus Nijhoff Publishers, 1986
rights: by-nc-nd
citation:   Barredo Egusquiza, Josu and Hermanns, Lutz Karl Heinz and Fraile de Lerma, Alberto and Jimeno, Juan Carlos and Alarcón Álvarez, Enrique  (2007).  The Influence of Different Surface Treatments on the Mechanical Strength of Silicon Wafers.  In: "22nd European Photovoltaic Solar Energy Conference and Exhibition", 03/09/2007-07/09/2007, Milan, Italia. ISBN 3-936338-2-80.    
document_url: https://oa.upm.es/21043/1/THE_INFLUENCE_OF_DIFFERENT_SURFACE_TREATMENTS_ON_THE.pdf