UV laser-induced high resolution cleaving of Si wafers for micro-nano devices and polymeric waveguide characterization

Casquel del Campo, Rafael; Holgado Bolaños, Miguel; García-Ballesteros Ramírez, Juan José; Zinoviev, K.; Férnandez-Sánchez, C.; Sanza Gutiérrez, Francisco Javier; Molpeceres Álvarez, Carlos Luis; Laguna Heras, Maria Fe; Llobera, A.; Ocaña Moreno, José Luis y Dominguez, C. (2011). UV laser-induced high resolution cleaving of Si wafers for micro-nano devices and polymeric waveguide characterization. "Applied Surface Science", v. 257 (n. 12); pp. 5424-5428. ISSN 0169-4332. https://doi.org/10.1016/j.apsusc.2010.11.021.

Descripción

Título: UV laser-induced high resolution cleaving of Si wafers for micro-nano devices and polymeric waveguide characterization
Autor/es:
  • Casquel del Campo, Rafael
  • Holgado Bolaños, Miguel
  • García-Ballesteros Ramírez, Juan José
  • Zinoviev, K.
  • Férnandez-Sánchez, C.
  • Sanza Gutiérrez, Francisco Javier
  • Molpeceres Álvarez, Carlos Luis
  • Laguna Heras, Maria Fe
  • Llobera, A.
  • Ocaña Moreno, José Luis
  • Dominguez, C.
Tipo de Documento: Artículo
Título de Revista/Publicación: Applied Surface Science
Fecha: Abril 2011
Volumen: 257
Materias:
Escuela: E.T.S.I. Industriales (UPM)
Departamento: Física Aplicada a la Ingeniería Industrial [hasta 2014]
Licencias Creative Commons: Reconocimiento - Sin obra derivada - No comercial

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Resumen

In this work we propose a method for cleaving silicon-based photonic chips by using a laser based micromachining system, consisting of a ND:YVO4laser emitting at 355 nm in nanosecond pulse regime and a micropositioning system. The laser makes grooved marks placed at the desired locations and directions where cleaves have to be initiated, and after several processing steps, a crack appears and propagate along the crystallographic planes of the silicon wafer. This allows cleavage of the chips automatically and with high positioning accuracy, and provides polished vertical facets with better quality than the obtained with other cleaving process, which eases the optical characterization of photonic devices. This method has been found to be particularly useful when cleaving small-sized chips, where manual cleaving is hard to perform; and also for polymeric waveguides, whose facets get damaged or even destroyed with polishing or manual cleaving processing. Influence of length of the grooved line and speed of processing is studied for a variety of silicon chips. An application for cleaving and characterizing sol–gel waveguides is presented. The total amount of light coupled is higher than when using any other procedure.

Más información

ID de Registro: 11170
Identificador DC: http://oa.upm.es/11170/
Identificador OAI: oai:oa.upm.es:11170
Identificador DOI: 10.1016/j.apsusc.2010.11.021
Depositado por: Memoria Investigacion
Depositado el: 26 Jun 2012 11:06
Ultima Modificación: 21 Ago 2017 11:41
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