Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects

Barredo Egusquiza, Josu; Hermanns, Lutz Karl Heinz; Rey Llorente, Ignacio del; Fraile de Lerma, Alberto y Alarcón Álvarez, Enrique (2011). Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects. En: "26th European Photovoltaic Solar Energy Conference and Exhibition", 05/09/2011 - 09/09/2011, Hamburgo, Alemania. ISBN 3-936338-27-2. pp. 1585-1588. https://doi.org/10.4229/26thEUPVSEC2011-2BV.2.55.

Descripción

Título: Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects
Autor/es:
  • Barredo Egusquiza, Josu
  • Hermanns, Lutz Karl Heinz
  • Rey Llorente, Ignacio del
  • Fraile de Lerma, Alberto
  • Alarcón Álvarez, Enrique
Tipo de Documento: Ponencia en Congreso o Jornada (Artículo)
Título del Evento: 26th European Photovoltaic Solar Energy Conference and Exhibition
Fechas del Evento: 05/09/2011 - 09/09/2011
Lugar del Evento: Hamburgo, Alemania
Título del Libro: Proceedings of 26th European Photovoltaic Solar Energy Conference and Exhibition
Fecha: 2011
ISBN: 3-936338-27-2
Materias:
Escuela: E.T.S.I. Industriales (UPM)
Departamento: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Licencias Creative Commons: Reconocimiento - Sin obra derivada - No comercial

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Resumen

EWT solar cells start from drilled wafers with approximately 100 holes/cm2. These holes act as stress concentrators leading to a reduction in the mechanical strength of this type of wafers. The viability of cells with higher density of holes has been studied. To this end, sets of wafers with different density of holes have been characterized. The ring on ring test has been employed and FE models have been developed to simulate the test. The statistical evaluation permits to draw conclusions about the reduction of the strength depending on the density of holes. Moreover, the stress concentration around the holes has been studied by means of the FE method employing the sub-modeling technique. The maximum principal stress of EWT wafers with twice the density of holes of commercial ones is almost the same. However, the mutual interaction between the stress concentration effects around neighboring holes is only observed for wafers with a density of 200 holes/cm2

Más información

ID de Registro: 13108
Identificador DC: http://oa.upm.es/13108/
Identificador OAI: oai:oa.upm.es:13108
Identificador DOI: 10.4229/26thEUPVSEC2011-2BV.2.55
Depositado por: Memoria Investigacion
Depositado el: 30 Nov 2012 10:42
Ultima Modificación: 21 Abr 2016 12:25
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