Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects

Barredo Egusquiza, Josu and Hermanns, Lutz Karl Heinz and Rey Llorente, Ignacio del and Fraile de Lerma, Alberto and Alarcón Álvarez, Enrique (2011). Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects. In: "26th European Photovoltaic Solar Energy Conference and Exhibition", 05/09/2011 - 09/09/2011, Hamburgo, Alemania. ISBN 3-936338-27-2. pp. 1585-1588. https://doi.org/10.4229/26thEUPVSEC2011-2BV.2.55.

Description

Title: Optimizing the Density of Holes of EWT Solar Cells Taking Into Consideration Mechanical Aspects
Author/s:
  • Barredo Egusquiza, Josu
  • Hermanns, Lutz Karl Heinz
  • Rey Llorente, Ignacio del
  • Fraile de Lerma, Alberto
  • Alarcón Álvarez, Enrique
Item Type: Presentation at Congress or Conference (Article)
Event Title: 26th European Photovoltaic Solar Energy Conference and Exhibition
Event Dates: 05/09/2011 - 09/09/2011
Event Location: Hamburgo, Alemania
Title of Book: Proceedings of 26th European Photovoltaic Solar Energy Conference and Exhibition
Date: 2011
ISBN: 3-936338-27-2
Subjects:
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

EWT solar cells start from drilled wafers with approximately 100 holes/cm2. These holes act as stress concentrators leading to a reduction in the mechanical strength of this type of wafers. The viability of cells with higher density of holes has been studied. To this end, sets of wafers with different density of holes have been characterized. The ring on ring test has been employed and FE models have been developed to simulate the test. The statistical evaluation permits to draw conclusions about the reduction of the strength depending on the density of holes. Moreover, the stress concentration around the holes has been studied by means of the FE method employing the sub-modeling technique. The maximum principal stress of EWT wafers with twice the density of holes of commercial ones is almost the same. However, the mutual interaction between the stress concentration effects around neighboring holes is only observed for wafers with a density of 200 holes/cm2

More information

Item ID: 13108
DC Identifier: http://oa.upm.es/13108/
OAI Identifier: oai:oa.upm.es:13108
DOI: 10.4229/26thEUPVSEC2011-2BV.2.55
Deposited by: Memoria Investigacion
Deposited on: 30 Nov 2012 10:42
Last Modified: 21 Apr 2016 12:25
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