Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers

Barredo Egusquiza, Josu and Hermanns, Lutz Karl Heinz and Fraile de Lerma, Alberto and Jimeno, Juan Carlos and Alarcón Álvarez, Enrique (2009). Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers. In: "24th European Photovoltaic Solar Energy Conference and Exhibition", 21/09/2009-25/09/2009, Hamburg, Germany. ISBN 3-936338-25-6.

Description

Title: Study of the Edge and Surface Cracks Influence in the Mechanical Strength of Silicon Wafers
Author/s:
  • Barredo Egusquiza, Josu
  • Hermanns, Lutz Karl Heinz
  • Fraile de Lerma, Alberto
  • Jimeno, Juan Carlos
  • Alarcón Álvarez, Enrique
Item Type: Presentation at Congress or Conference (Article)
Event Title: 24th European Photovoltaic Solar Energy Conference and Exhibition
Event Dates: 21/09/2009-25/09/2009
Event Location: Hamburg, Germany
Title of Book: Proceedings of the 24th European Photovoltaic Solar Energy Conference
Date: 2009
ISBN: 3-936338-25-6
Subjects:
Freetext Keywords: Cost reduction ; Defects ; Characterization
Faculty: E.T.S.I. Industriales (UPM)
Department: Mecánica Estructural y Construcciones Industriales [hasta 2014]
Creative Commons Licenses: Recognition - No derivative works - Non commercial

Full text

[img]
Preview
PDF - Requires a PDF viewer, such as GSview, Xpdf or Adobe Acrobat Reader
Download (481kB) | Preview

Abstract

The objective of the present study is the estimation of the depth to which the wire sawing process causes damage to the wafer surfaces. Previous analyses were carried out by means of the four line bending test. The characteristic of this test implied that the failure could be due to surface cracks located in the central zone of the wafer or near the edges. In order to evaluate the influence of the edge or surface cracks a new study has been carried out using the ball/ring on ring test. Description and results of the tests are presented. The preliminary analysis of the failure stress using analytical methods confirms the expected results. A Finite Element model developed to get more information of the test results is also presented.

More information

Item ID: 21627
DC Identifier: http://oa.upm.es/21627/
OAI Identifier: oai:oa.upm.es:21627
Official URL: http://www.eupvsec-proceedings.com/proceedings?paper=5078
Deposited by: Biblioteca ETSI Industriales
Deposited on: 16 Nov 2013 07:37
Last Modified: 21 Apr 2016 12:19
  • Logo InvestigaM (UPM)
  • Logo GEOUP4
  • Logo Open Access
  • Open Access
  • Logo Sherpa/Romeo
    Check whether the anglo-saxon journal in which you have published an article allows you to also publish it under open access.
  • Logo Dulcinea
    Check whether the spanish journal in which you have published an article allows you to also publish it under open access.
  • Logo de Recolecta
  • Logo del Observatorio I+D+i UPM
  • Logo de OpenCourseWare UPM