Thermal analysis and modeling of embedded processors

Ayala Rodrigo, José Luis and Mendez, Candido and López Vallejo, Marisa (2010). Thermal analysis and modeling of embedded processors. "Computers and Electrical Engineering", v. 36 (n. 1); pp. 142-154. ISSN 0045-7906. https://doi.org/10.1016/j.compeleceng.2009.07.001.

Description

Title: Thermal analysis and modeling of embedded processors
Author/s:
  • Ayala Rodrigo, José Luis
  • Mendez, Candido
  • López Vallejo, Marisa
Item Type: Article
Título de Revista/Publicación: Computers and Electrical Engineering
Date: January 2010
ISSN: 0045-7906
Volume: 36
Subjects:
Freetext Keywords: Thermal model; Embedded processor; Temperature
Faculty: E.T.S.I. Telecomunicación (UPM)
Department: Ingeniería Electrónica
Creative Commons Licenses: Recognition - No derivative works - Non commercial

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Abstract

This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.

More information

Item ID: 8453
DC Identifier: http://oa.upm.es/8453/
OAI Identifier: oai:oa.upm.es:8453
DOI: 10.1016/j.compeleceng.2009.07.001
Official URL: http://www.sciencedirect.com/science/journal/00457906
Deposited by: Memoria Investigacion
Deposited on: 22 Aug 2011 10:34
Last Modified: 20 Apr 2016 17:13
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