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ORCID: https://orcid.org/0000-0001-6448-7936, López Vallejo, Marisa
ORCID: https://orcid.org/0000-0002-3833-524X, Sánchez Marcos, Miguel Ángel and Gomez Osuna, Carlos
(2010).
Design of an Efficient Interconnection Network of Temperature Sensors.
En: "25th Conference on Design of Circuits and Integrated Systems", 17/11/2010 - 19/11/2010, Lanzarote, España.
| Título: | Design of an Efficient Interconnection Network of Temperature Sensors |
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| Autor/es: |
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| Tipo de Documento: | Ponencia en Congreso o Jornada (Artículo) |
| Título del Evento: | 25th Conference on Design of Circuits and Integrated Systems |
| Fechas del Evento: | 17/11/2010 - 19/11/2010 |
| Lugar del Evento: | Lanzarote, España |
| Título del Libro: | Proceedings of the 25th Conference on Design of Circuits and Integrated Systems |
| Fecha: | 2010 |
| Materias: | |
| ODS: | |
| Escuela: | E.T.S.I. Telecomunicación (UPM) |
| Departamento: | Ingeniería Electrónica |
| Licencias Creative Commons: | Reconocimiento - Sin obra derivada - No comercial |
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Temperature has become a first class design constraint because high temperatures adversely affect circuit reliability, static power and degrade the performance. In this scenario, thermal characterization of ICs and on-chip temperature monitoring represent fundamental tasks in electronic design. In this work, we analyze the features that an interconnection network of temperature sensors must fulfill. Departing from the network topology, we continue with the proposal of a very light-weight network architecture based on digitalization resource sharing. Our proposal supposes a 16% improvement in area and power consumption compared to traditional approaches
| ID de Registro: | 9187 |
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| Identificador DC: | https://oa.upm.es/9187/ |
| Identificador OAI: | oai:oa.upm.es:9187 |
| Depositado por: | Memoria Investigacion |
| Depositado el: | 19 Oct 2011 11:38 |
| Ultima Modificación: | 20 Abr 2016 17:42 |
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